Technical Library | 2023-09-15 11:40:46.0
Improve your PCB assembly process with our advanced offline PCBA router machine. Achieve precision and speed in PCB separation for top-quality results
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2021-10-12 18:01:49.0
The existence of counterfeit products, e.g., integrated circuits (ICs) and printed circuit boards (PCBs), in the modern semiconductor supply chain has seriously jeopardized the security and reliability of electronic systems, and has also caused the loss of suppliers' profit and reputation. Most of existing research papers prevent or detect counterfeit IC and PCB substrate separately, without testing the PCB as a whole, and often require the assistance of external equipment. In this article, a novel ring oscillator- based PCB authentication (ROPA) methodology to detect counterfeit PCB through supply chain is proposed, which ...
Technical Library | 2011-10-20 22:03:30.0
Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters.
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
Technical Library | 2010-09-23 20:23:37.0
Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thi
Technical Library | 2016-11-08 16:47:18.0
Over time most PCB designs need to change – a mistake is found, or a part becomes obsolete, etc. Typically once the changes are complete, a new set of manufacturing files (Gerbers, NC Drill files, BOM, Pick and Place, etc) are generated, and the updated design is stored as separate version within a version control system. Using a version control system makes it possible for design teams to go back later and compare differences between design versions. ****** http://www.numericalinnovations.com/blogs/news/gerber-comparisons-between-revisions-of-the-same-board *****
Technical Library | 2022-01-05 23:10:11.0
Waste electrical and electronic equipment or e-waste generation has been skyrocketing over the last decades. This poses waste management and value recovery challenges, especially in developing countries. Printed circuit boards (PCBs) are mainly employed in value recovery operations. Despite the high energy costs of generating crushed and milled particles of the order of several microns, those are employed in conventional hydrometallurgical techniques. Coarse PCB pieces (of order a few centimetres) based value recovery operations are not reported at the industrial scale as the complexities of the internal structure of PCBs limit efficient metal and non-metal separation.
Technical Library | 2016-04-08 01:19:52.0
PCB assembly designs become more complex year-on-year, yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge. So long as librarians at the design and manufacturing levels continue to maintain their own local standards for component representation, there is no common representation in the design-to-manufacturing phase of the product lifecycle that can provide the basis for transfer of manufacturing process rules to the design level. A comprehensive methodology must be implemented for all component types, not just the minority which happen to conform to formal packaging standards, to successfully left-shift assembly and test DFM analysis to the design level and thus compress NPI cycle times.(...)This paper will demonstrate the technological components of the working solution: the logic for deriving repeatable and standardized package and pin classifications from a common source of component physical-model content, the method for associating DFA and DFT rules to those classifications, and the transfer of those rules to separate DFM and NPI analysis tools elsewhere in the design-through-manufacturing chain resulting in a consistent DFM process across multiple design and manufacturing organizations.
Technical Library | 2021-06-07 19:06:32.0
The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of the elements of electronic equipment is the printed circuit board (PCB) and almost every electronic equipment has a PCB inside it. While waste PCB (WPCB) recycling may result in the recovery of potentially precious materials and the reuse of some components, it is a challenging task because its composition diversity requires a cautious pre-processing stage to achieve optimal recycling outcomes. Our research focused on proposing a method to evaluate the economic feasibility of recycling integrated circuits (ICs) from WPCB. The proposed method can help decide whether to dismantle a separate WPCB before the physical or mechanical recycling process and consists of estimating the IC area from a WPCB, calculating the IC's weight using surface density, and estimating how much metal can be recovered by recycling those ICs. To estimate the IC area in a WPCB, we used a state-of-the-art object detection deep learning model (YOLO) and the PCB DSLR image dataset to detect the WPCB's ICs. Regarding IC detection, the best result was obtained with the partitioned analysis of each image through a sliding window, thus creating new images of smaller dimensions, reaching 86.77% mAP. As a final result, we estimate that the Deep PCB Dataset has a total of 1079.18 g of ICs, from which it would be possible to recover at least 909.94 g of metals and silicon elements from all WPCBs' ICs. Since there is a high variability in the compositions of WPCBs, it is possible to calculate the gross income for each WPCB and use it as a decision criterion for the type of pre-processing.
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Manufacturer of automated production systems;PCB magazine loader,PCB separator,PCB cutting machine,PCB unloaders, PCB conveyors,PCB depaneling machines,PCB turn conveyors,PCB conformal coaters,PCB solder paste printer,PCB buffer
Industrial zone, Da sha village, Dalingshan town
Dongguan, 30 China
Phone: 8613377777085
