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3D ICs With TSVs - Design Challenges And Requirements

Technical Library | 2010-12-09 20:26:15.0

As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int

Cadence Design Systems, Inc.