Technical Library | 2013-08-08 15:23:11.0
In this project Machine Vision PCB Inspection System is applied at the first step of manufacturing, i.e., the making of bare PCB. We first compare a PCB standard image with a PCB image, using a simple subtraction algorithm that can highlight the main problem-regions. We have also seen the effect of noise in a PCB image that at what level this method is suitable to detect the faulty image. Our focus is to detect defects on printed circuit boards & to see the effect of noise. Typical defects that can be detected are over etchings (opens), under-etchings (shorts), holes etc...
Technical Library | 2021-05-06 13:41:55.0
Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new technologies are expected to control the production quality based on the digital images. However, current algorithms sometimes are not accurate enough to meet the quality control. Specialists are needed to do a follow-up checking. For automated X-ray inspection, joint of interest on the X-ray image is located by region of interest (ROI) and inspected by some algorithms. Some incorrect ROIs deteriorate the inspection algorithm.
Technical Library | 2024-04-29 21:19:42.0
Over the years, computer vision and machine learning disciplines have considerably advanced the field of automated visual inspection for Printed Circuit Board (PCB-AVI) assurance. However, in practice, the capabilities and limitations of these advancements remain unknown because there are few publicly accessible datasets for PCB visual inspection and even fewer that contain images that simulate realistic application scenarios. To address this need, we propose a publicly available dataset, "FICS-PCB"1, to facilitate the development of robust methods for PCB-AVI. The proposed dataset includes challenging cases from three variable aspects: illumination, image scale, and image sensor. This dataset consists of 9,912 images of 31 PCB samples and contains 77,347 annotated components. This paper reviews the existing datasets and methodologies used for PCBAVI, discusses challenges, describes the proposed dataset, and presents baseline performances using feature engineering and deep learning methods for PCB component classification.
Technical Library | 2011-08-11 20:06:48.0
(Proceedings of the World Congress on Engineering 2011) A Printed Circuit Board (PCB) consists of circuit with electronic components mounted on surface. There are three main steps involved in manufacturing process, where the inspection of PCB is necessar
Sant Longowal Institute of Engineering and Technology (SLIET)
Technical Library | 2021-11-22 20:32:10.0
The aim of this work is to define a procedure to develop diagnostic systems for Printed Circuit Boards, based on Automated Optical Inspection with low cost and easy adaptability to different features. A complete system to detect mounting defects in the circuits is presented in this paper. A low cost image acquisition system with high accuracy has been designed to fit this application. Afterward, the resulting images are processed using the Wavelet Transform and Neural Networks, for low computational cost and acceptable precision. The wavelet space represents a compact support for efficient feature extraction with the localization property. The proposed solution is demonstrated on several defects in different kind of circuits.
Technical Library | 2008-04-15 14:43:08.0
The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges.
Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences
Technical Library | 2021-12-21 23:15:44.0
High Density Interconnect (HDI) technologies are being used widely in Asia and Europe in consumer electronics for portable wireless communication and computing, digital imaging, and chip packaging. Although North America lags behind in developing process capability for this technology, HDI will become a significant business segment for North America. For this to happen, the printed circuit board shops will have to become process capable in fabricating fine lines and spaces, and also be capable in forming and plating microvias.
Technical Library | 2021-05-06 13:45:49.0
The high-sensitive micro eddy-current testing (ECT) probe composed of planar meander coil as an exciter and spin-valve giant magneto-resistance (SV-GMR) sensor as a magnetic sensor for bare printed circuit board (PCB) inspection is proposed in this paper. The high-sensitive micro ECT probe detects the magnetic field distribution on the bare PCB and the image processing technique analyzes output signal achieved from the ECT probe to exhibit and to identify the defects occurred on the PCB conductor. The inspection results of the bare PCB model show that the proposed ECT probe with the image processing technique can be applied to bare PCB inspection. Furthermore, the signal variations are investigated to prove the possibility of applying the proposed ECT probe to inspect the high-density PCB that PCB conductor width and gap are less than 100 μm.
Technical Library | 2013-08-15 13:12:11.0
An automated visual PCB inspection is an approach used to counter difficulties occurred in human’s manual inspection that can eliminates subjective aspects and then provides fast, quantitative, and dimensional assessments. In this study, referential approach has been implemented on template and defective PCB images to detect numerous defects on bare PCBs before etching process, since etching usually contributes most destructive defects found on PCBs. The PCB inspection system is then improved by incorporating a geometrical image registration, minimum thresholding technique and median filtering in order to solve alignment and uneven illumination problem. Finally, defect classification operation is employed in order to identify the source for six types of defects namely, missing hole, pin hole, underetch, short-circuit, mousebite, and open-circuit.
Technical Library | 2020-03-26 14:55:29.0
This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic microtopographic 3D imaging of challenging objects that are difficult or impossible to scan with traditional methods, such as machine vision or laser triangulation.Examples of well-suited applications for line confocal technology include glossy, mirror-like, transparent and multi-layered surfaces made of metals (connector pins, conductor traces, solder bumps etc.), polymers (adhesives, enclosures, coatings, etc.), ceramics (components, substrates, etc.) and glass (display panels, etc.). Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory. The operational principle of the line confocal method and its strengths and limitations are discussed.Three metrology applications for the technology in electronics product manufacturing are examined: 1. 3D imaging of etched PCBs for micro-etched copper surface roughness and cross-sectional profile and width of etched traces/pads. 2. Thickness, width and surface roughness measurement of conductive ink features and substrates in printed electronics applications. 3. 3D imaging of adhesive dots and lines for shape, dimensions and volume in PCB and product assembly applications.
.gif)