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Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement

Technical Library | 2016-05-30 22:24:00.0

As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.

Flex (Flextronics International)

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