Technical Library: screen printer sp1 (Page 1 of 1)

Tackling SMT Enemy Number One - Raising The Standard of Solder Paste Application

Technical Library | 2009-05-14 13:57:43.0

Is screen printing technology able to keep pace with rising quality demands and increasingly complex board layouts? Or, is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differences. Screen printers offer some possibilities for optimizing solder paste deposits, but optimization is far easier and quicker with the jet printer. At the same time, the ability to print individualized deposits on every single pcb pad may be the ultimate answer to the growing quality challenge.

Mycronic AB

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Technical Library | 2007-12-13 17:03:02.0

Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.

ASM Assembly Systems (DEK)

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