Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Technical Library | 2020-02-13 08:41:18.0
Efficient bonding, sealing and potting has a major influence on the sustainable function and safety of electronic components. The key to success here lies in the comprehensive view and control of process engineering. Here it pays to seek collaboration with the systems and the material manufacturer during the very early stages of the project. This is because dispensing systems must be selected for compatibility with the workpiece and the adhesive, sealant or potting compound used. And there are also other factors that play an important role in designing the optimum dispensing system:
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Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.
2762 Loker Ave West
Carlsbad, CA USA
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