Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Technical Library | 2023-11-25 07:46:13.0
In the dynamic realm of Surface Mount Technology (SMT), where efficiency and precision are paramount, I.C.T, a renowned SMT equipment manufacturer, proudly unveils its latest innovation – the I.C.T-910 Automatic IC Programming System. Crafted to cater to the intricate demands of SMD chip programming, this cutting-edge device vows to redefine your programming experience and elevate production capabilities. Programming system.png The Power of IC Programming System: As a beacon of excellence in IC Programming Systems, the I.C.T-910 seamlessly integrates advanced technology with user-friendly features. This system empowers manufacturers in the SMT industry, offering versatility in programming needs by accommodating a wide range of SMD chips. Precision Programming: The I.C.T-910 boasts unparalleled precision in programming SMD chips, ensuring accuracy in every generated code. In the SMT industry, where even the slightest error can lead to setbacks, this precision is indispensable. Efficiency Redefined: Accelerate your production timelines with the I.C.T-910's efficient programming capabilities. Engineered to optimize workflows, this system ensures rapid programming without compromising quality, recognizing that time is money in the SMT industry. User-Friendly Interface: Navigating the complexities of IC programming is simplified with the I.C.T-910's intuitive user interface. Operators, even without extensive programming expertise, can harness the system's power, minimizing the learning curve and maximizing productivity. Compatibility and Adaptability: The I.C.T-910 breaks free from limitations, supporting a wide array of SMD chip models. It is a versatile solution for diverse programming requirements, allowing you to stay ahead of technological advancements. Why Choose I.C.T-910 IC Programming System? 8 sets of 32-64sit burners Nozzle: 4pcs Camera: 2pcs (Component camera + Marking camera) UPH: 2000-3000PCS/H Package type: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP, and so on. Compatibility: Adapters provided based on customer products. Simple operation interface: Modular and layered interface with pictures and texts for easy operation. System upgrade: Free software upgrade service. Reliability: Trust in the I.C.T-910, a programming system that prioritizes reliability. Rigorous testing ensures consistent and dependable performance, reducing the risk of programming errors and downtime. Elevate Your Competitiveness: Incorporate the I.C.T-910 into your production line to elevate competitiveness in the market. Stay ahead with a programming system designed to meet the demands of the fast-paced SMT industry. Embrace the Future with I.C.T-910: In a landscape where precision, efficiency, and adaptability are non-negotiable, the I.C.T-910 Automatic IC Programming System emerges as the game-changer for SMT manufacturers. Revolutionize your programming processes, enhance productivity, and future-proof your operations with the I.C.T-910. Choose I.C.T-910 and stay ahead in the SMT industry, ushering in the next era of IC programming excellence.
Technical Library | 2023-09-18 03:53:42.0
好的，以下是根据标题"LED Lens Production Line Solution"写的SEO元描述和标题： SEO Meta Description (300 characters) LED Lens Production Line Solutions: The Complete Package for Efficient and Reliable LED Lens Manufacturing Our LED lens production line solutions are the perfect way to improve your LED lens manufacturing efficiency and reliability. Our solutions include all the equipment and services you need to produce high-quality LED lenses, from lens molding to assembly.
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
Technical Library | 2022-04-28 06:42:19.0
I. Chip capacitors(MLCC) The full name of chip capacitors: multilayer (multilayer, laminated) chip ceramic capacitors, also known as chip capacitors, chip capacitance.
Technical Library | 2022-04-27 01:34:43.0
SMD capacitors and resistors have small sizes and many models. Some manufacturers buy a lot of products and do not use them up in time. The problem of storage is always a headache. So how should chip capacitors and resistors be stored? There are also precautions when using chip capacitors. Please see the following information and hope it will help you.
Technical Library | 2021-12-16 01:45:05.0
In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2010-11-18 19:19:50.0
In this article we present both a relatively new and innovative family of packages that is suitable for medium pin count needs and an innovative method for fabricating the substrates for such a package. With respect to lead count, this packaging family is
Technical Library | 2017-09-14 01:21:52.0
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the shorter interconnect resulting from this effort has contributed to improving both electrical performance and functional capability. (...) This paper outlines both positive and negative aspects of current 3D package innovations and addresses the challenges facing adopters of silicon and glass based interposer fabrication. The material presented will also reference 3D packaging standards and recognize innovative technologies from a number of industry sources, roadmaps and market forecasts.
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