Technical Library | 2022-12-05 16:22:13.0
This paper reviews the possible causes and effects for no-fault-found observations and intermittent fail- ures in electronic products and summarizes them into cause and effect diagrams. Several types of inter- mittent hardware failures of electronic assemblies are investigated, and their characteristics and mechanisms are explored. One solder joint intermittent failure case study is presented. The paper then discusses when no-fault-found observations should be considered as failures. Guidelines for assessment of intermittent failures are then provided in the discussion and conclusions.
Technical Library | 2023-01-10 20:03:37.0
Since the IPC-4552 rev A for ENIG was introduced there have been many requests for clarification of acceptable and unacceptable levels of nickel corrosion. This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed. The study will attempt to produce level 1, level 2, and level 3 corrosion as denoted by IPC-4552 rev A and tabulate wetting balance results and congruity of intermetallic formed.
Technical Library | 2023-12-18 20:41:20.0
This review of inert atmosphere for the electronics assembly processes will look at the benefits and attempt to close the gap on some of the misconceptions of using inert gases for electronics assembly. We will look at the reasons for using nitrogen and the cost benefits that come with the use of this inert atmosphere gas. As part of this review we will be explain the needs assessment and when you should use an inert atmosphere for your assembly process. Case studies will be provided to demonstrate the benefits of an inert atmosphere in the electronics assembly process area.
Technical Library | 2024-07-24 01:27:58.0
A study of the Thermo Design PCB Indicates The better the performance of the heatsink (=low Rth), the more influence the TIMs have The thickness of a TIM is often more critical than the thermal conductivity of the material The thermal resistance of the surface between the materials are most critical Better use many small vias than a few big vias! Plated or filled vias are very expensive to get, better try to stay with standard!
Technical Library | 2009-10-08 01:58:04.0
In the present study, we report novel ferroelectric-epoxy based polymer nanocomposites that have the potential to surpass conventional composites to produce thin film capacitors over large surface areas, having high capacitance density and low loss. Specifically, novel crack resistant and easy to handle Resin Coated Copper Capacitive (RC3) nanocomposites capable of providing bulk decoupling capacitance for a conventional power-power core, or for a three layer Voltage-Ground-Voltage type power core, is described.
Technical Library | 2015-04-30 20:17:03.0
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied. First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail. And the usefulness of the copper foil with low surface roughness has been demonstrated.
Technical Library | 2016-05-30 22:24:00.0
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.
Technical Library | 2019-07-24 23:55:32.0
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes.
Technical Library | 2021-01-13 21:34:29.0
Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ...
Technical Library | 2021-02-25 14:19:00.0
This study proposes a new design of lightweight and cost-e#14;cient composite materials for the aeronautic industry utilizing recycled fresh scrap rubber, epoxy resin, and graphene nanoplatelets (GnPs). After manufacturing the composites, their bending strength and fracture characteristics were investigated by three-point bending (3PB) tests. Halpin–Tsai homogenization adapted to composites containing GnPs was used to estimate the moduli of the composites, and satisfactory agreement with the 3PB test results was observed.
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