Technical Library | 2017-09-14 01:21:52.0
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the shorter interconnect resulting from this effort has contributed to improving both electrical performance and functional capability. (...) This paper outlines both positive and negative aspects of current 3D package innovations and addresses the challenges facing adopters of silicon and glass based interposer fabrication. The material presented will also reference 3D packaging standards and recognize innovative technologies from a number of industry sources, roadmaps and market forecasts.
1 |
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Distributor / Consultant / Service Provider
3th, Tangchang 3rd Road, Hengli, Dongguan City
Dongguan, China
Phone: 008615629932323