Technical Library: temperatur room (Page 1 of 1)

A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested

Technical Library | 2020-12-07 15:26:06.0

Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.

ACI Technologies, Inc.

Enhancing Mechanical Shock Performance Using Edgebond Technology

Technical Library | 2014-06-26 16:43:12.0

Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.

Cisco Systems, Inc.

Room Temperature Fast Flow Reworkable Underfill For LGA

Technical Library | 2016-10-03 08:28:47.0

With the miniaturization of electronic device, Land Grid Array (LGA) or QFN has been widely used in consumer electronic products. However there is only 20-30 microns gap left between LGA and the substrate, it is very difficult for capillary underfill to flow into the large LGA component at room temperature. Insufficient underfilling will lead to the loss of quality control and the poor reliability issue. In order to resolve these issues, a room temperature fast flow reworkable underfill has been successfully developed with excellent flowability. The underfill can flow into 20 microns gap and complete the flow of 15mm distance for about 30 seconds at room temperature. The curing behavior, storage, thermal cycling performance and reworkability will be discussed in details in this paper.

YINCAE Advanced Materials, LLC.

Comparing Techniques for Temperature-Dependent Warpage Measurement

Technical Library | 2008-03-13 13:02:50.0

Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique.

Akrometrix

A Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive - Capillary Underfill Replacement

Technical Library | 2016-01-12 11:07:56.0

With the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, YINCAE has published a white paper on a first individual solder joint encapsulant which can eliminate underfilling process with at least five times solder joint increase and provide more flexibility for fine pitch and high density application. In order to meet the demand of manufacturing of high speed and low cost, YINCAE has invented a room temperature stable and jettable solder joint encapsulant adhesive – SMT 266. The invention of SMT 266 has allowed our customers to have more flexibility in their high-speed production line such as worry free on the work life of adhesive and workable jetting process.

YINCAE Advanced Materials, LLC.

Thermal Curing of Conformal Coatings

Technical Library | 2015-07-27 16:58:29.0

When it comes to the application of conformal coating, curing the coating plays a key role in the circuit assembly and selective conformal coating process. Curing conformal coating occurs after the coating spray/dispense process is complete. The coating is considered “cured” when the conformal coating on the circuit assembly is sufficiently tack-free to be handled. Curing can sometimes be accomplished at room temperature but takes a considerable amount of time to dry. Accelerated conformal coating curing decreases this drying period, the cure process reaches either the tack-free or a fully dried state but not quite having fully cured properties. Accelerated curing techniques include one or a combination of heat, moisture, UV light, and chemical reaction curing. This article focuses primarily on thermal or heat curing.

ETS - Energy Technology Systems, Inc.

How to Use the Right Flux for the Selective Soldering Application

Technical Library | 2017-05-17 22:33:43.0

The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.

Kester

How to extend the lifespan of climatic test chamber?

Technical Library | 2019-05-06 23:13:09.0

Temperature and humidity test chamber has brought a lot of help to many industrial enterprises, but while it brings convenience to us, we should also take good care of them, otherwise they may be brought into the end-of-life phase ahead of time. The way of maintenance is also very simple. After daily use, the equipment is cleaned regularly, but the cleaning of the test chamber is also very skillful. If the operation is wrong, it may also lead to equipment failure. Let‘s learn how to extend the service life of the temperature and humidity test box together. 1, Pls clean the working room with water after each use, then dry the interior with dry cotton cloth. 2, Pls regularly remove dust from the evaporator inside the equipment, and periodically wipe the equipment to ensure clean and tidy. 3, When doing the test, the sample should be uniformly placed onto sample shelves,and the vent should not be blocked to prevent the influence of the test 4, It is necessary to pay attention to the cleaning of water tanks in peacetime, after the test or when the equipment is not intended to be used for a long time, all the water in the tank should be discharged, otherwise it will lead to the formation of scale inside the tank. The water used in the temperature and humidity test chamber must be pure or distilled water, or long-term use may result in a humidifier or internal pipe clogging. Above are the usual use notice of temperature and humidity test chamber, if customer adhere to the above several points,it is really able to prolong the service life of the equipment.

Symor Instrument Equipment Co.,Ltd

Dust removal in temperature and humidity Test Chamber (2/2)

Technical Library | 2019-05-21 00:21:26.0

Continue to talk about the dust removal from temperature humidity test chamber. Cleaning and maintenance: 1) Pls remove internal impurities inisde chamber before operation. 2) The power distribution room should be cleaned at least once a year, and the dust can be removed by vacuum cleaner. 3) The exterior chamber must also be cleaned more than once a year, which can be wiped with soapy water. Inspection and maintenance of humidifier: The water storage in humidifier should be replaced once a month to ensure clean water quality, humidifying water tray should be cleaned once a month to ensure smooth flow of water. The inspection of over-temperature protector:during the test: If the temperature is over 20 ℃ ~ 30 ℃ than the maximum value setted,the power supply of the heater will stop, the "OVERHEAT" overt-emperature warning light will automatically turn on but the fan is still in operation, if the equipment runs without operator around,the operator should check the over-temperature protector in advance to ensure wether it has been setted properly before start [wet ball over-temperature protector set to 120 ℃].

Symor Instrument Equipment Co.,Ltd

Maintenance and operation of walk-in temperature humidity test chamber

Technical Library | 2019-11-17 22:46:45.0

Overview of walk-in temperature and humidity chamber: It also belongs to environmental test equipment, it tests whether the product can resist high temperature, low temperature, humidity, or the physical and chemical changes produced under extreme conditions, the walk-in temperature and humidity chamber volume is large, the product is placed, or a large object can be placed, such as automobile, new energy, television and liquid crystal screen, etc. How to do the routine maintenance of the walk-in temperature and humidity chamber: 1. The wet gauze basically, if there is no special case, s/b usually changed once in 3 months 2. The water channel shall be regularly cleaned, including water cup, water tank, etc., so as to prevent the water from being blocked,affect the humidity test. 3. It is forbidden to test the flammable and explosive products inside working room. 4. Clean the chamber on a regular basis 2. How to operate walk-in temperature and humidity chamber: The operation method is same as standard temperature humidity test chamber,the controller is 7-inch LCD programmable color screen, you only need to setthe temperature point---test time--how many cycles need to be tested, This can be done automatically, and the machine will stop automatically when it is complete. If there is any problem during the operation, the corresponding problem point will be displayed on the machine control screen. Walk-in temperature and humidity chamber is a must equipment for reliability test of Automobile,Aerospace,Electronic parts,etc,the operation and maintenance are easy,it is teh tear down mahcine,Climatest engineers will be dispatched to do on-site support,for instance,we will finish commissioning,train customers how to operate,maintain,welcome to follow our company facebook page:https://www.facebook.com/Climatechambers

Symor Instrument Equipment Co.,Ltd

  1  

temperatur room searches for Companies, Equipment, Machines, Suppliers & Information

SMTAI 2024 - SMTA International

High Precision Fluid Dispensers
Potting and Encapsulation Dispensing

High Throughput Reflow Oven
PCB Handling Machine with CE

World's Best Reflow Oven Customizable for Unique Applications
2024 Eptac IPC Certification Training Schedule

Component Placement 101 Training Course