Technical Library | 2024-08-27 07:45:38.0
Skype:+8615359408275 WhatsApp:+8615359408275 Telephone:+8615359408275 Email:sales5@mooreplc.com WeChat:15359408275 Product Features: High Durability: Built to withstand extreme environmental conditions. Precision Engineering: Ensures reliable and accurate performance. Energy Efficient: Optimized for low power consumption. Compact Design: Suitable for space-constrained installations. Application Areas: Industrial Automation: Used in automation systems requiring high reliability. Aerospace: Ideal for aerospace applications where precision is critical. Telecommunications: Applied in communication systems for stable and consistent performance. Medical Devices: Suitable for integration into advanced medical equipment.
Technical Library | 2021-06-07 19:06:32.0
The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of the elements of electronic equipment is the printed circuit board (PCB) and almost every electronic equipment has a PCB inside it. While waste PCB (WPCB) recycling may result in the recovery of potentially precious materials and the reuse of some components, it is a challenging task because its composition diversity requires a cautious pre-processing stage to achieve optimal recycling outcomes. Our research focused on proposing a method to evaluate the economic feasibility of recycling integrated circuits (ICs) from WPCB. The proposed method can help decide whether to dismantle a separate WPCB before the physical or mechanical recycling process and consists of estimating the IC area from a WPCB, calculating the IC's weight using surface density, and estimating how much metal can be recovered by recycling those ICs. To estimate the IC area in a WPCB, we used a state-of-the-art object detection deep learning model (YOLO) and the PCB DSLR image dataset to detect the WPCB's ICs. Regarding IC detection, the best result was obtained with the partitioned analysis of each image through a sliding window, thus creating new images of smaller dimensions, reaching 86.77% mAP. As a final result, we estimate that the Deep PCB Dataset has a total of 1079.18 g of ICs, from which it would be possible to recover at least 909.94 g of metals and silicon elements from all WPCBs' ICs. Since there is a high variability in the compositions of WPCBs, it is possible to calculate the gross income for each WPCB and use it as a decision criterion for the type of pre-processing.
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
Technical Library | 2021-10-12 18:01:49.0
The existence of counterfeit products, e.g., integrated circuits (ICs) and printed circuit boards (PCBs), in the modern semiconductor supply chain has seriously jeopardized the security and reliability of electronic systems, and has also caused the loss of suppliers' profit and reputation. Most of existing research papers prevent or detect counterfeit IC and PCB substrate separately, without testing the PCB as a whole, and often require the assistance of external equipment. In this article, a novel ring oscillator- based PCB authentication (ROPA) methodology to detect counterfeit PCB through supply chain is proposed, which ...
Technical Library | 2015-02-05 20:25:41.0
In the past 20 yrs the solvent industry has gone through a great deal of change. In the early 1990s, CFC-113 and 1,1,1-trichloroethane were the workhorses of the industry. The Montreal Protocol to phase-out substances that deplete the Earth's protective Ozone Layer was implemented in the mid 1990s. After phase-out of the CFC solvents, the solvent industry fragmented to a variety of cleaning solutions. The electronics industry was a large user of CFC solvents and many of these applications changed to aqueous based cleaners (...) But those alternatives are now facing various problems: e.g. aqueous based cleaners use a lot of energy, require long drying times, use equipment that requires frequent maintenance, and require a large footprint; no-clean fluxes leave flux residues; and trichloroethylene and n-propyl bromide have toxicity issues. In response to these serious issues newer solvents and blends are being introduced in the marketplace
Technical Library | 2021-12-08 01:19:32.0
In modern society, mobile phone is almost a necessity for everyone. When your mobile phone is not around, you may easily feel anxious as if something is missing, which is called nomophobia. In the past, people used to check if they had taken money when they went out. But now, mobile phone is the thing people must take. As is known to us, as long as you take a mobile phone, it's easy to get food, clothes, and to take transport. Look at our mobile phones, you will find almost all of them are equipped with touch screens now, which are much better than the early keyboard for using. So, how much do you know about HMI touch screens in industrial scenes?
Technical Library | 2016-07-28 17:00:20.0
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.
Technical Library | 2021-06-07 19:10:16.0
The aim of this study was to compare leaching characteristics of metals from printed circuit boards (PCBs), taken from waste electrical and electronic equipment in the presence and in the absence of the iron-oxidizing bacteria, Acidithiobacillus ferrooxidans. A. ferrooxidans not only increases the leached concentration of Cu from the PCBs, but also inhibits the components of the 0K medium and leached Cu from forming precipitates such as libethenite (Cu2(PO4)(OH)), thereby assisting Cu recovery from the PCBs. In addition, the leached concentration of Pb from PCBs decreased in the presence of A. ferrooxidans, due to Pb forming amorphous precipitates. It is expected that Pb is not highly toxic to A. ferrooxidans. Consequently, A. ferrooxidans can be used as a cost-effective and environmentally friendly way to leach out valuable metals from PCBs as low-grade urban ore.
Technical Library | 2023-11-14 19:52:11.0
The continuous drive in the Electronics industry to build new and innovative products has caused competitive design companies to develop assemblies with consolidated PCB designs, decreased physical sizes, and increased performance characteristics. As a result of these new designs, manufacturers of electronics are forced to contend with many challenges. One of the most significant challenges being the processing of thru-hole components on high thermal mass PCBs having the potential to exceed 20 layers in thicknesses and have copper mass contents of over 40oz. High thermal mass PCBs, coupled with the use of mixed technologies, decreased component spacing, and the change from Tin Lead Solder to Lead Free Alloys has lead many manufacturing facilities to purchase advanced soldering equipment to process challenging assemblies with a high degree of repeatability.
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
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