Technical Library: vapour phase (Page 1 of 1)

Common Process Defect Identification of QFN Packages

Technical Library | 2019-07-23 22:33:47.0

The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.

Nordson DAGE

  1  

vapour phase searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling with CE

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
SMT spare parts - Qinyi Electronics

Best Reflow Oven
High Throughput Reflow Oven

Smt Feeder repair service centers in Europe, North, South America
Win Source Online Electronic parts

We offer SMT Nozzles, feeders and spare parts globally. Find out more
Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
Electronic Solutions R3

"Heller Korea"