1 vi technology 3d spi result

Solder Paste Inspection Technologies: 2D-3D Correlation

Technical Library | 2008-05-28 18:41:53.0

This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment.

Speedline Technologies, Inc.