Technical Library | 2020-04-14 15:49:38.0
The number of through-hole components on printed circuit boards (PCB) has declined significantly over the last decade. Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering. Soldering these small, fine-pitch components is a challenge when surface mount components (SMD) are positioned very close to THT components on the PCB layout. This study, done in cooperation with a large automotive EMS customer, defines the process windows for through-hole technology for fine-pitch components. It determines what is feasible to solder and defines layout design parameter that make soldering possible with SMD areas and other components on the assembly.
Technical Library | 2020-04-29 03:25:11.0
1CLICKSMT has recently installed a odd form component inserting and wave soldering line for a security products manufacturer.
Technical Library | 2020-03-01 23:06:45.0
For though hole soldering, no matter it's wave soldering or selective soldering, the process is same formed by fluxing,preheating,soldering. How these 3 process will change the soldering result? When you face the soldering defects, what could be the reasons caused these and how to debug them? With below information you may get some hints.
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