Technical Library | 2023-08-16 18:13:53.0
In one of our Consumer Electronics projects, a smart lighting company wished to dispense silicone-based LED encapsulation material for two different product sizes. The larger product had a 9mm circular dam which required silicone dispensing flush with the top of the dam. The smaller product had a 1mm LED die that required only the top to be encapsulated. The material consisted of two parts which were mixed by weight in a 1:1 ratio. A phosphor powder was added totaling 10% of the overall weight. The phosphor required agitation to remain suspended.
Technical Library | 2017-06-14 21:33:00.0
Flexible circuitry may be preferable to rigid circuitry in situations where space or weight is limited.
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
Technical Library | 2019-05-13 04:05:15.0
For the customers of LED lamp industry, LED board splitter is indispensable. Our machine is cheap, light weight and cutting speed is 500 mm per second. email:s1@hk-yush.com
Technical Library | 2022-10-31 08:41:57.0
Model Name: CUTTER HOUSING ASSY Patch Speed: 10000 (grains/hour) Applicable Model: Plug-in Machine Accessories Category: Industrial Equipment Weight: About 500g Automatic Manual: Automatic
Technical Library | 2006-11-14 12:48:31.0
Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package
Technical Library | 2009-09-09 14:30:40.0
Power supply design for avionics has become an area of increased activity over the past few years. New to the market are industrial quality, high current, lithium based battery systems. Available from a wide variety of vendors, these batteries are characterized by their low weight and high- energy availability...
Technical Library | 2011-04-07 14:50:29.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB t
Technical Library | 2008-02-04 12:13:38.0
Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums.
Technical Library | 2019-05-01 10:07:37.0
Adhesive bonding involves the use of adhesive to form a material bond between two or more assembly parts. In addition to regular adhesive bonding applications, hybrid processes, in which the adhesive bond includes another function such as sealing or heat dissipation, are gaining importance. Traditional joining methods such as welding or bolting are progressively being replaced in industrial applications by efficient adhesive bonding processes, since these processes provide a number of advantages such as part weight reduction or simplified parts handling.
