Technical Library | 2023-08-18 03:28:47.0
Today, KINGSUN shares with you the common types and classifications of SMT mounters. 一、According to the feeding method, common ones include: 1.Tape Feeder 2.Tray Feeder 3.Tube Feeder 4.Stick Feeder 5.Special Vibration Feeder 二、According to the classification of electric and non electric, the common ones are electric feeder and mechanical feeder. Yamaha's SIGMA SMT machines are all electric feeders, while many of JUKI's feeder are mechanical feeders...... Regarding feeders related knowledge, KINGSUN share with you here , hoping to be helpful to you. More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com . "DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD" is a leading SMT automation equipment factory provider in China. With many years of profound experience accumulation, we provides comprehensive solutions for global customers with strong resources and high-quality professional technical team.
Technical Library | 2023-08-14 09:06:53.0
In the operation of SMT mounter, the process and integrity of the nozzle of the mounter will have a significant impact on the performance of the machine. As one of the important components of the SMT machine, it is necessary for us to carry out daily maintenance and upkeep of the SMT nozzle. To ensure that the suction nozzle of the SMT machine is intact before operation, how should we do a good job of maintaining the suction nozzle of the SMT machine during normal use? KINGSUN technical team analysis operation has the following main points: 1.Wipe the surface of the SMT nozzle with a dust-free cloth. 2.The small aperture nozzle can be passed through with a thin steel wire and then blown with an air gun. 3.The surface of the nozzle should not be soaked with corrosive solution such as alcohol, as this may cause the surface to fall off. 4.HOLDER should use a cotton swab to wipe the cavity and not damage the filter screen. 5.Regular addition of special grease to HOLDER claws. 6.According to production, it is best to regularly maintain and do other maintenance regularly. (* Suitable for Yamaha SMT machine nozzles , JUKI SMT machine nozzles, Samsung SMT machine nozzles, Panasonic SMT machine nozzles, Fuji SMT machine nozzles, Siemens SMT machine nozzles etc.) Regarding the SMT machine nozzle daily maintenance operation instructions, KINGSUN share with you here , hoping to be helpful to you. More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com , thanks.
Technical Library | 1999-08-05 10:52:56.0
This technology transfer was prepared by the Research Triangle Institute (RTI) as part of SEMATECH's Facility Fluids Project (S100). It is a compilation of information on existing facility fluids metric and test methods. Information on standard methods was gathered from SEMATECH and SEMI. Other information was obtained from a literature search of journals and conference proceedings. The published information primarily is concerned with the test equipment used and what levels of detection and purity were found. Many of the articles discussed the use of new equipment, either commercial or experimental. Extensive annotated bibliographies are append to the report.
Technical Library | 2024-02-06 14:36:04.0
Quality monitoring for verifiable, high-precision application of adhesives and sealants now begins with detecting the position of the component. Dispensing systems are in continuous use and have to work with 100 percent accuracy. And this level of accuracy must be verifiable. Demands on electronic components continue to escalate as these components also need to operate continuously and flawlessly, especially in the automotive and medical sectors. At the same time, there is increasing pressure to automate as companies are looking to achieve the shortest possible cycle times and maximum output.
Technical Library | 2017-08-10 01:23:22.0
This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules.
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
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