Technical Library | 2010-05-27 22:12:10.0
The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN. In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.
Technical Library | 2013-12-11 23:24:32.0
Today's analyses of electronics reliability at the system level typically use a "black box approach", with relatively poor understanding of the behaviors and performances of such "black boxes" and how they physically and electrically interact (...) The incorporation of more rigorous and more informative approaches and techniques needs to better understand (...) Understanding the Physics of Failure (PoF) is imperative. It is a formalized and structured approach to Failure Analysis/Forensics Engineering that focuses on total learning and not only fixing a particular current problem (...) In this paper we will present an explanation of various physical models that could be deployed through this method, namely, wire bond failures; thermo-mechanical fatigue; and vibration.
Technical Library | 2017-10-12 15:45:25.0
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.
Technical Library | 2023-06-12 16:52:47.0
The technological advancement of component and PCB technology from through-hole to surface mount (SMT) is a major factor in the miniaturization of today's electronics. Smaller and smaller component sizes and more densely packed PCBs lead to more powerful designs in much smaller product packages. With advancement, however, comes a new set of challenges in building these smaller, more complex assemblies. This is the challenge original equipment manufacturers (OEM) and contract manufacturers (CM) face today.
| 1 |
