Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | Pick and Place/Feeders
Substrate size: for M substrate (330×250mm) L substrate (410×360mm) L-wide substrate (510×360mm) component height: 6mm specification component size: laser recognition 0603 (imperial
Used SMT Equipment | SMT Equipment
The KE-2050 is typically used as a compliment to the KE-2060 to increase overall throughput by placing the higher volume small chip components SOTs and ICs. ■ 13,200CPH：chip (laser centering/effective tact) ■ One multi-nozzle laser head (4 n
Used SMT Equipment | Chipshooters / Chip Mounters
The KE-2010 is typically used as a compliment to the KE-2020 to increase overall throughput by placing the higher volume small chip components SOTs and ICs. ■ 10,000CPH：chip (laser centering/effective tact) ■ One multi-nozzle
Used SMT Equipment | Chipshooters / Chip Mounters
The KE-2050 is typically used as a compliment to the KE-2060 to increase overall throughput by placing the higher volume small chip components SOTs and ICs. ■ 13,200CPH：chip (laser centering/effective tact) ■ One multi-nozzle
Used SMT Equipment | SMT Equipment
The High-speed Modular Mounter FX-1R is a traditional modular chip shooter driven at extreme speeds. Refinements in the drive system deliver real world improvements in actual throughput. ■ 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) ■
Used SMT Equipment | SMT Equipment
The ultra-flexible KE-2060 can place a wide range of components from 0603 and ICs, to odd-form, all at a high rate of speed. ■ 12,500CPH：chip (laser centering/effective tact) ■ 1,850CPH: IC (vision centering/effective tact), 3,400CPH with MNVC
