Used SMT Equipment | Pick and Place/Feeders
Device Name: Samsung SM411, Samsung SM411 Mater, Second-hand Samsung SM411 Mater Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH and
Used SMT Equipment | Pick and Place/Feeders
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Used SMT Equipment | Pick and Place/Feeders
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-S720-A MACHINE Hardware Configuration Image signal input unit Main unit Power supply Air Camera Illumination Image resolution Feed method Line height PCB carrier width adjustment Ambient operating temperature Ambient opera
Used SMT Equipment | AOI / Automated Optical Inspection
BF-Frontier is used in the inspection of large-size printed circuit boards. In this device, the unique control sequence of software and hardware, accelerated scanning mode and stable optical illumination system can allow BF-Frontier to easily complet
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-RNS2-L Omron AoiVT-RNSⅡ parameters Hardware part LSIZE Image signal input part Camera 3CCD camera Lighting series Ring LED (R.G.B) Image resolution 10, 15, 20um Mechanism part Transmission method Belt transmission method Producti
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm~maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm~Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&