Used SMT Equipment | Pick and Place/Feeders
Yamaha YS12 Pick & Place Model: YS12 (KHY-000) Year: 2012 Complete & Operational Applicable PCB: L510 x W460mm to L50 x W50mm CPH: 36,OOO Mounting accuracy Absolute accuracy (.u+30) : +/-0.05mm/CHIP Applicable components 0402 to
Used SMT Equipment | Pick and Place/Feeders
Type name high-speed veneer KE-2070M / KE -2070L / KE -2070E Substrate size M substrate(330 X 250mm) ○ L substrate(410 X 360mm) ○ E substrate(510 X 460mm) ○ Component height 6mm specification ○ 12Mm specification ○ 20Mm specification _ 25Mm sp
Used SMT Equipment | SMT Equipment
The KE-2050 is typically used as a compliment to the KE-2060 to increase overall throughput by placing the higher volume small chip components SOTs and ICs. ■ 13,200CPH：chip (laser centering/effective tact) ■ One multi-nozzle laser head (4 n
Used SMT Equipment | SMT Equipment
The High-speed Modular Mounter FX-1R is a traditional modular chip shooter driven at extreme speeds. Refinements in the drive system deliver real world improvements in actual throughput. ■ 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) ■
Used SMT Equipment | Chipshooters / Chip Mounters
The KE-2010 is typically used as a compliment to the KE-2020 to increase overall throughput by placing the higher volume small chip components SOTs and ICs. ■ 10,000CPH：chip (laser centering/effective tact) ■ One multi-nozzle
Used SMT Equipment | Chipshooters / Chip Mounters
The KE-2050 is typically used as a compliment to the KE-2060 to increase overall throughput by placing the higher volume small chip components SOTs and ICs. ■ 13,200CPH：chip (laser centering/effective tact) ■ One multi-nozzle
Used SMT Equipment | SPI / Solder Paste Inspection
3D SPI system inline 3 D camera min. paste size 150x150µm max. paste size 20x20mm max. paste hight 1000µm min. PCB size 50x50mm max. PCB size 500x510m PCB thickness 0,4mm - 4mm measurements 1060mm (width) x 1285mm (length) x 1400mm (hight) weight 10
Used SMT Equipment | Chipshooters / Chip Mounters
0402(mm)parts support is standard Optional side-lighting on side 2 for BGA/CSP Buffer on out-conveyor Optional nozzle auto changer [for faster changeovers, nozzle change during auto production will be also supported.] Optional single
Used SMT Equipment | SMT Equipment
The High-speed Modular Mounter FX-1R is a traditional modular chip shooter driven at extreme speeds. Refinements in the drive system deliver real world improvements in actual throughput. ■ 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) ■
Used SMT Equipment | SMT Equipment
The ultra-flexible KE-2060 can place a wide range of components from 0603 and ICs, to odd-form, all at a high rate of speed. ■ 12,500CPH：chip (laser centering/effective tact) ■ 1,850CPH: IC (vision centering/effective tact), 3,400CPH with MNVC
