Used SMT Equipment | Board Cleaners
Looking for an Aqueous Batch Cleaner. Please send us informtion if you have one for sale. Thanks in advance
Used SMT Equipment | Chipshooters / Chip Mounters
sFAB-D machines have continued to evolve since their release to the market. They are able to insert parts into various panels with a wide range of support in part packaging. As an entry model, sFAB-SH machines are now added into the same product line
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Used SMT Equipment | Pick and Place/Feeders
Vintage: 2011 Hours: 20,000 Configuration: Single Conveyor Left to Right Module 1 V12 head (module is set for V advance) Module 2 V12 head (2) P05 cameras (1) Spare H08M h
Used SMT Equipment | SPI / Solder Paste Inspection
The Best Value 3D SPI Solution ·Advanced 3D Measurement Accuracy and Inspection Reliability -Solves shadow problems by utilizing 2-way projection - Accurate inspection data with real-time PCB warp compensation -Minimize Cost and Maximi
Used SMT Equipment | Pick and Place/Feeders
Panasonic NPM-D3A Modular Pick And Place MachineThe NPM-D3 is an industry standard building block in high-speed, high volume applications ranging from automotive to industrial to medical. In fact, the vast majority of automotive EMS providers choose
Used SMT Equipment | Chipshooters / Chip Mounters
NXT IIIC has the same features of the NXT III but in a smaller footprint. This allows you to maximize production in a restricted floorspace environment.Fuji Scalable Placement Platform. The best floorspace productivity in the industry. One NXT IIIc m
Used SMT Equipment | Chipshooters / Chip Mounters
NXT-H and NXT-Hw support placing small LEDs and bare dies at high-speed as well as performing hybrid production including flip chips.Fuji Ultra Accurate Placement Platform.Hybrid placement of wafers and SMDs. Wafer and reel part placement in a single
Used SMT Equipment | Chipshooters / Chip Mounters
NXT-H and NXT-Hw support placing small LEDs and bare dies at high-speed as well as performing hybrid production including flip chips.Fuji Ultra Accurate Placement Platform.Hybrid placement of wafers and SMDs. Wafer and reel part placement in a single
Used SMT Equipment | SPI / Solder Paste Inspection
MS-11e 3D SPI Equipment High Speed Precision In-Line SPI Equipment System Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System. 10 Micron / Pixel Precision TELECENTRIC COMPOUND LENS Design Advanced Dual Projection SHADOW FREE MOIRé Design 2 Micron Heig
Used SMT Equipment | Soldering - Selective
Vitronics Soltec Zeva V Selective Soldering Date of Manufacture: 2018 Details: Inline Preheat Offline Programming Auto Width Adjust SMEMA Interface Advanced Solder Feeder Max PCB: 310 x 410mm Solder Pot Volume: MW 180kg / SW 45kg
