Used SMT Equipment: bga crack ball package (Page 1 of 1)

DEK Horizon 03i Printer

DEK Horizon 03i Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03i automatic stencil printer Specification : DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Dage Series 4000 Bondtester

Dage Series 4000 Bondtester

Used SMT Equipment | Semiconductor & Solar

Bondtester by DAGE, in good condition. DAGE Series 4000 Bondtester product information. The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull

Fix Trade BV

Mirtec MV-3L

Mirtec MV-3L

Used SMT Equipment | AOI / Automated Optical Inspection

Mirtec MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13100524-0524 DOM: 24 MAY 20102D InspectionPower: 85-264V / 4.4A / 50-60 HzINSPECTION AREA: 450 x 400 mmINSPECTION ITEMS: Lifted Lead, Lifted Comp

Fortunetech Inc.

Mirtec MV-3U

Mirtec MV-3U

Used SMT Equipment | AOI / Automated Optical Inspection

2015 MIRTEC MV-3U LARGE PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13150216-1452 DOM: 16 FEB 20152D Inspection​5 Camera Inspection SystemPower: 85-264V / 4.4A / 50-60 HzINSPECTION AREA: 660mm x 510 mmIN

Fortunetech Inc.

Mirtec MV-3L 2D AOI

Used SMT Equipment | AOI / Automated Optical Inspection

2011 MIRTEC MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13110930-0839 DOM: 30 SEP 2011 2D Inspection Power: 85-264V / 4.4A / 50-60 Hz INSPECTION AREA: 450 x 400 mm INSPECTION ITEMS:&n

Fortunetech Inc.

Universal Instruments Universal AdVantis AC-30L SMT Placement

Universal Instruments Universal AdVantis AC-30L SMT Placement

Used SMT Equipment | Chipshooters / Chip Mounters

30 intelligent spindle assemblies      -> All vision processing is performed “on the fly” to maximize throughput.      -> Continuous updates of X, Y, and Z-height pickup and placement locations ● On-The-Head Cameras      -> narrow field of view c

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bga crack ball package searches for Companies, Equipment, Machines, Suppliers & Information

Baja Bid Auction JUL 9-10, 2024

Easily dispense fine pitch components with ±25µm positioning accuracy.
2024 Eptac IPC Certification Training Schedule

Component Placement 101 Training Course
PCB Handling Machine with CE

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.