Used SMT Equipment: bga missing (Page 1 of 1)

Panasonic NPM W2 pick and place machine

Panasonic NPM W2 pick and place machine

Used SMT Equipment | Pick and Place/Feeders

FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual

Qinyi Electronics Co.,Ltd

Assembleon Topaz X

Assembleon Topaz X

Used SMT Equipment | Pick and Place/Feeders

Assembleon Topaz X Multi-Fuction Placer With LCS Available! 4 Standard Change Heads & 4 FNC Heads Component Range:  0201 to 32mm Square   Placement Rate:18,000CPH (Chips), 2,500 (QPP)    Maximum Board Size:  460mm x 440mm (18.1" x 17.3")  

Thinking Productivity Inc

Mirtec MV-3L 2D AOI

Used SMT Equipment | AOI / Automated Optical Inspection

2011 MIRTEC MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13110930-0839 DOM: 30 SEP 2011 2D Inspection Power: 85-264V / 4.4A / 50-60 Hz INSPECTION AREA: 450 x 400 mm INSPECTION ITEMS:&n

Fortunetech Inc.

Mirtec MV-3L

Mirtec MV-3L

Used SMT Equipment | AOI / Automated Optical Inspection

Mirtec MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13100524-0524 DOM: 24 MAY 20102D InspectionPower: 85-264V / 4.4A / 50-60 HzINSPECTION AREA: 450 x 400 mmINSPECTION ITEMS: Lifted Lead, Lifted Comp

Fortunetech Inc.

Mirtec MV-3U

Mirtec MV-3U

Used SMT Equipment | AOI / Automated Optical Inspection

2015 MIRTEC MV-3U LARGE PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13150216-1452 DOM: 16 FEB 20152D Inspection​5 Camera Inspection SystemPower: 85-264V / 4.4A / 50-60 HzINSPECTION AREA: 660mm x 510 mmIN

Fortunetech Inc.

Universal Instruments Universal AdVantis AC-30L SMT Placement

Universal Instruments Universal AdVantis AC-30L SMT Placement

Used SMT Equipment | Chipshooters / Chip Mounters

30 intelligent spindle assemblies      -> All vision processing is performed “on the fly” to maximize throughput.      -> Continuous updates of X, Y, and Z-height pickup and placement locations ● On-The-Head Cameras      -> narrow field of view c

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