Used SMT Equipment: flip chip bonder finetech (Page 1 of 1)

Besi / ESEC 8800FC

Besi / ESEC 8800FC

Used SMT Equipment | Semiconductor & Solar

Besi #DC8800FC Quantum High Speed Flip Chip Bonder Offline Curing Machine w/Datacon #Etx 1.1 Port Controls, Scanner, Power Supply: 3/N/PE/208/220/240/400 VAC, 50/60Hz, (Serial#: 950 8874 3355) Auction will be on April 3, 2018 at 11 AM Online Throug

Paul E. Saperstein Co., Inc

Panasert FCB-2M  some sets of machinery online auction.

Panasert FCB-2M some sets of machinery online auction.

Used SMT Equipment | Conveyors

Speedlines Camalot1818 Underfill     Agilent SJ 50 AOI     Universal GSM PTF     Panasonic FCB-2M Flip Chip Bonder       Speedlines MPM accuflex Solder Paste Printer       DEK 265 GSX Solder Paste Printing      Autolink Engineering PTE LTD R4200 Offl

CS-Auction,Co,Ltd

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flip chip bonder finetech searches for Companies, Equipment, Machines, Suppliers & Information

High Throughput Reflow Oven

Training online, at your facility, or at one of our worldwide training centers"
2024 Eptac IPC Certification Training Schedule

High Resolution Fast Speed Industrial Cameras.
Baja Bid Auction JUL 9-10, 2024

Easily dispense fine pitch components with ±25µm positioning accuracy.