Used SMT Equipment | SPI / Solder Paste Inspection
KY8030-2L MFD : 2013 Very good working condition
Used SMT Equipment | SPI / Solder Paste Inspection
Conditon:good overhaul done. like new.
Used SMT Equipment | X-Ray Inspection
Description: 3D SPI Vintage: 2010: upgrades done by the OEM in the past year Operating system: Windows7
Used SMT Equipment | SMT Equipment
Kohyoung SPI aSPIre Dual 2012 vintage - 10um pixel resolution - Max PCB size as a Dual Lane : 510*250mm each lane - Max PCB size as a Single Lane : 510*430mm each lane
Used SMT Equipment | SPI / Solder Paste Inspection
The Best Value 3D SPI Solution ·Advanced 3D Measurement Accuracy and Inspection Reliability -Solves shadow problems by utilizing 2-way projection - Accurate inspection data with real-time PCB warp compensation -Minimize Cost and Maximi
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Used SMT Equipment | SPI / Solder Paste Inspection
KOH YOUNG 3D SPI KY8030-2 The Industry’s Most Popular True 3D Solder Paste Inspection System The KY8030-2 has maintained the industry’s leading position as the best-selling True 3D Solder Paste Inspection System since entering the market. Com
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YOUNG KY8030-2 3D SPI The World's Best-selling Full 3D Solder Paste Inspection Best-in-class measurement accuracy and inspection reliability Solves shadow problems by utilizing 2-way projection Provides accurate inspection data with real-time P
Used SMT Equipment | SPI / Solder Paste Inspection
Description: 3D Solder Paste Inspection System Vintage: 2016 O/S: Windows 7 Ultimate Details: • 4-Way High Speed Projection Upgrade (for KY8030-3) 3D Inspection GUI, Gerber conversion software • SPC Plus software(Statistical P
Used SMT Equipment | SPI / Solder Paste Inspection
Make: Koh Young Model: 8030-3L Vintage: 2011 Details: • Windows XP Operating System • 3D • 4M Pixel High Speed Camera • Automatic Conveyor Width Adjustment • Front/Rear Fixed Conveyor • SPC Plu
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
