Used SMT Equipment | Screen Printers
2.0 Cmk @ ± 12.5 μm (± 6 sigma) System alignment capability > 2.0 Cmk @ ± 25 μm (± 6 sigma) Optimum core cycle time 8 seconds Substrate size 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) Operating System Windows 7 Embe
Used SMT Equipment | SMT Equipment
Product name: YS88 multi-function module chip mounter Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mm components, the wide range of special-shaped long joint element The height of the object elem
Used SMT Equipment | SMT Equipment
Product name: YS88 multi-function module chip mounter Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mm components, the wide range of special-shaped long joint element The height of the object elem
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our Orbotech Symbion S36 AOI For Sale. The system is Year 2006.... Excellent condition !!! Complete with all accessories and manuals. Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI p
Used SMT Equipment | Screen Printers
Board Handling Specification Minimum Size 40 x 50mm Maximum Size 510 x 508mm Thickness 0.2mm - 6mm Maximum Weight 1Kg Warpage Up to 8mm including PCB thickness Underside Component Clearance Programmable 3mm - 42mm Transport Conveyors Programma
Used SMT Equipment | Soldering - Selective
Max PCB or pallet size 310 x 410 mmMax PCB weight 10 kgSolder pot volume MW 180 kg / SW 45 kgMax soldering area 250 x 350 mmN2 consumption 75 L/minMaximum components height top side 120 mmPower supply 3 x 400V 50/60 HzCjhmhbg00wMachine size (L x W x
Used SMT Equipment | SPI / Solder Paste Inspection
Vi Technology 3D SPI 3D Solder Paste Inspection System Model: 4000L 3D SPI Year: 2009 Accuracy and warp compensation Unmatched true resolution, accuracy and repeatability Full-featured absolute measurement of the full board surface, mapping to
Used SMT Equipment | Soldering - Selective
System for selective miniwave soldering, dip soldering or conventional wave soldering processes. Up to two soldering units can be integrated in one machine. Maximum assembly dimensions of 500 x 500 mm (19.68" x 19.68"). High precision double portal a
Used SMT Equipment | Pick and Place/Feeders
Make: PanasonicModel: NPM-W2 Details:1.High-Quality Mounting - APC system controls board and component deviations to ensure good product production.2.Large Board and Component Compatibility - Capable of handling large boards up to 750 × 550 mm and co
.gif)
