Used SMT Equipment | SPI / Solder Paste Inspection
Make: VI Technologies Model: 3D Solder Paste Inspection Vintage: 2009 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow free ins
Used SMT Equipment | Visual Inspection
Make: VI Technolgoies Model: 3D XPi 400L Solder Paste Inspection Vintage: 2008 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow
Used SMT Equipment | SPI / Solder Paste Inspection
Vintage: 2008 Description: 3D Solder Paste Inspection Details: • 3D sensing system w/ built-in fiducial camera and lighting • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max PCB width: 20” x 20” • Max inspection
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Used SMT Equipment | Soldering - Reflow
HELLER 1809 MKIII Reflow OvenYear 2009Left to Right flowEdge Hold Conveyor Center Board SupportCE certificationPlease contact us for details.
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI HS70 3D Solder Paste Inspection Machine (2011) Brand: Parmi Model: HS70 Solder Paste Inspection Machine Serial #: H7S0 Year: 2011 Machine Specifications: Software Version: Parmi 3D SPI v1.5.1.2 Conveyor Inspection Program: Single Lane
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Used SMT Equipment | SPI / Solder Paste Inspection
Vi Technology 3D SPI In-line Solder Paste Inspection (AOI) System • Model: 3D XPI 4000L • Vintage: 04/2008 • Voltage 220 • FAHP (Flying Absolute Height Profilometry) Measurement method • Dual Light Source and On-the-fly Image scan • High power M/H li
Used SMT Equipment | SPI / Solder Paste Inspection
Vi Technology 3D SPI In-line Solder Paste Inspection (AOI) System • Model: 3D SPI • Vintage: 11/2009 • Voltage: 220 • FAHP (Flying Absolute Height Profilometry) Measurement method • Dual Light Source and On-the-fly Image scan • High power M/H light 3
Used SMT Equipment | SPI / Solder Paste Inspection
Vi Technology 3D SPI 3D Solder Paste Inspection System Model: 4000L 3D SPI Year: 2009 Accuracy and warp compensation Unmatched true resolution, accuracy and repeatability Full-featured absolute measurement of the full board surface, mapping to
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Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE300 (2004) Solder Paste Inspection Brand: Cyberoptics Model: SE300 Description: Solder Paste Inspection Serial: 10239 Year: 2004 Details: • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max pad size
Used SMT Equipment | Soldering - Reflow
Windows XP operation software with Chinese and English alternative available. whole system under integration control can analyze and display the failure. All production data can be saved completely and analyzed. PC& Siemens PLC controlling unit with
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