Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Used SMT Equipment | Semiconductor & Solar
Bondtester by DAGE, in good condition. DAGE Series 4000 Bondtester product information. The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull
Used SMT Equipment | SPI / Solder Paste Inspection
SKU 16529 • Fastest solder paste inspection (SPI) system • Excellent 3D inspection • 3D SPI system for mid- to high-volume manufacturing • Great inspection ability of lead-free manufacturing process and fine-pitch/01005 compon
Used SMT Equipment | Screen Printers
2014, Manncorp PB2300 semi-auto solder paste screen printer, with vision, good working condition. Also available with a 2014 Manncorp reflow oven and a 2008 MC387-V2 with feeders FOB: Origin / Ex-works Contact: AssuredTechnicalServiceLLC@Gmail.
Used SMT Equipment | SPI / Solder Paste Inspection
TRI TR7007 3D Solder Paste Inspection Technology, SPI, Year 2011 Test Research Inc. (TRI) Dynamic imaging offers an improved solution for 3D SPI in term of accuracy, speed and field of view (FOV). The main advantage of dynamic imaging is that inspe
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