Used SMT Equipment: wafer bumping (Page 1 of 1)

PARMI ZEUS-L

PARMI ZEUS-L

Used SMT Equipment | AOI / Automated Optical Inspection

3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn

INSPECTION TECH

Yamaha YSH20

Yamaha YSH20

Used SMT Equipment | Chipshooters / Chip Mounters

Dear All , We currently have 3 units YSH20 available in our stock, if you have any interesting, please contact me. Applicable PCB L50 x W30 to L250 x W200mm ****Up to L340 x W340mm" is applicable. Please contact us separately. Mounting c

Shenzhen Sawbor Technology Co., Ltd.

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