Used SMT Equipment | Pick and Place/Feeders
hip theoretical speed of 21,000CPH Mounting range 0402mm Chip to 55mm Placement accuracy plus or minus 0.03mm PCB size 460 * 400 * 4.2 ~ 50 * 40 * 0.38 Equipment size L1,650 * D1,680 * H1,530 Power 4.7KVA Equipment weight 1800kg Samsung SMT
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Parameter■ Speed : 92,000 CPH (Optimum, HS10 Head) ■ Structure : 2 Gantry x 10 Spindles/Head ■ Accuracy : ±28μm Cpk≥1.0 (03015 Chip) ±25μm Cpk≥1.0 (IC) ■ Parts Size : 03015 ~ 12mm, H10mm ■ PCB Size : 50 x 40 ~ 510 x 460mm (Standard) ~ 740 x 460mm (
Used SMT Equipment | Pick and Place/Feeders
Chip theoretical speed of 21,000CPH Mounting range 0402mm Chip to 55mm Placement accuracy plus or minus 0.03mm PCB size 460 * 400 * 4.2 ~ 50 * 40 * 0.38 Equipment size L1,650 * D1,680 * H1,530 Power 4.7KVA Equipment weight 1800kg Samsung SM
Used SMT Equipment | Pick and Place/Feeders
Device Name: Samsung SM411, Samsung SM411 Mater, Second-hand Samsung SM411 Mater Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH and
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Used SMT Equipment | Chipshooters / Chip Mounters
I-PULSE M20 Chip Mounter model LE6-000 l New type of large field of view high-precision 2 million pixel ultra-high-speed (3000mm/sec) digital scanning camera l 0402(01005)－□120mm×90mm component corresponding range l High-perf
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