Industry News: 0402 crack capacitor (Page 1 of 3)

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

IPC/JEDEC-9704A Takes the Stress Out of Strain Gage Testing

Industry News | 2012-05-23 14:18:26.0

Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

How To Set Profile In SMT Reflow Oven

Industry News | 2018-10-18 09:37:27.0

How To Set Profile In SMT Reflow Oven

Flason Electronic Co.,limited

AVX Expands USB Series Transient Voltage Suppressors with 0402 Case Size

Industry News | 2003-05-19 09:53:51.0

The USB Series offers problem free solderability characteristics as well as excellent electrical performance

AVX Corporation

Nihon Superior Introduces Lead-free Solder Paste for 0402 Metric Chip Components

Industry News | 2009-03-05 15:03:01.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces the development of SN100C P520 D5 lead-free solder paste for 0402 metric chip components.

Nihon Superior Co., Ltd.

Nihon Superior to Premier New SN100C Products at APEX 2009

Industry News | 2009-03-10 16:11:29.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Nihon Superior Co., Ltd.

Koh Young SPI Dispenses Solder Paste for 0402M (01005) Microchips

Industry News | 2018-09-04 10:25:16.0

Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.

Koh Young America, Inc.

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