Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Industry News | 2003-01-24 09:07:53.0
For Industrial, Telecom and Datacom Use
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Industry News | 2011-02-24 21:39:40.0
The assembly of solar panels is very similar to the assembly of printed boards, making solar power a hot opportunity for electronics assemblers. A small but growing market, solar module production is projected to increase 273% from 2010 to 2014, according to iSuppli. Shedding some light on the rapidly advancing business of solar panel assembly, IPC will host the Solar Assembly and Solar Living Pavilion on the show floor at IPC APEX EXPO, April 12–14, 2011, in Las Vegas.
Industry News | 2020-09-22 11:01:36.0
IPC and Power Sources Manufacturers Association (PSMA) have signed a Memorandum of Understanding (MoU) pledging to build a strong complementary relationship between the two entities with a focus on standards development, education and training.
Industry News | 2010-05-30 23:23:13.0
Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.
Industry News | 2010-08-17 13:31:00.0
The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
