Industry News: 1

New SMARC®-compliant MRZG2LS and MRZV2LS SoMs from ARIES Embedded

Industry News | 2023-09-28 07:36:23.0

System-on-Modules Based on Renesas RZ Family with Dual Cortex®-A55/M33 CPU Provide High Performance for Industrial Video Applications

ARIES Embedded GmbH

ARIES Embedded Introduces SMARC®-compliant MRZG2LS and MRZV2LS SoMs

Industry News | 2023-10-09 09:23:38.0

New System-on-Modules Based on Renesas RZ Family with Dual Cortex®-A55/M33 CPU Provide High Performance for Industrial Video Applications

ARIES Embedded GmbH

Cognex to Demonstrate Vision Systems and Sensors at NPE 2012

Industry News | 2012-01-30 13:30:05.0

Cognex Corporation will demonstrate its latest vision and ID systems in Booth #4248 at the upcoming International Plastics Showcase.

Cognex Corporation

JJS continues to invest and expand its electronics assembly capabilities.

Industry News | 2013-04-12 08:14:52.0

Following on from recent investments to augment its test facilities, including a new flying probe tester and additional AOI facilities, the investment continues at JJS Electronics with orders recently placed for a complete new state-of- the-art surface mount line. The line is in response to increased demand for their PCB assembly services and will be fully operational in January.

JJS Electronics LTD

Inovar Increases Throughput and Flexibility with Selective Solder from Ersa

Industry News | 2015-03-30 18:16:10.0

Kurtz Ersa North America announces that Inovar has purchased a VERSAFLOW 3/45 selective soldering system with dual solder pots. Inovar is a leading contract manufacturer in the Intermountain West located in Logan, Utah. The VERSAFLOW 3/45 will allow Inovar to run two alloys (tin-lead and lead-free) in one machine on-the-fly.

kurtz ersa Corporation

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2016-09-08 13:30:10.0

Engineered Material Systems is pleased to introduce the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-01-09 18:11:30.0

Engineered Material Systems is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-10-22 17:38:10.0

Engineered Material Systems is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

Ersa to Introduce XL Rework and Selective at APEX

Industry News | 2019-01-03 20:11:46.0

Kurtz Ersa will exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center in CA. The company will introduce the HR 600 XL and the VERSAFLOW 4XL with VERSAFLEX in Booth #2706.

kurtz ersa Corporation

Reduce Risk and Increase Productivity with Robotic Soldering

Industry News | 2019-01-30 20:37:50.0

Metcal today announced the global launch of the first Robotic Soldering System with patented Connection Validation (CV) technology and a touchscreen graphical user interface to drastically mitigate the risk of solder joint defects and add productivity to the manufacturers’ soldering process.

Metcal


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