Industry News: 10

IPC APEX EXPO Named In Top 25 Fastest-Growing Trade Shows Sold Out Show Floor Predicted for 2013

Industry News | 2012-06-23 10:33:03.0

IPC – Association Connecting Electronics Industries® announces that IPC APEX EXPO® has been named one of the Trade Show News Network 2012 “Top 25 Fastest-growing Trade Shows in Attendance in the United States.”

Association Connecting Electronics Industries (IPC)

MANNCORP �HI OUTPUT� TURNKEY LINE TARGETS MID TO HIGH-VOLUME FLEXIBLE SMT ASSEMBLY

Industry News | 2008-07-19 12:18:17.0

An automated turnkey line now offered by Manncorp includes a 4-head pick and place that provides assets of speed, flexibility and fast changeover. The �Hi Output Line� also includes an inline fully automatic stencil printer, an 8-zone reflow oven and pass-through conveyor, priced below $180,000 complete. According to CEO Henry Mann, �The 10,500 cph placement speed allows mid-volume assemblers to step-up throughput while benefitting from the increased savings and service advantages of purchasing the entire line from a single-source provider.�

Manncorp

MANNCORP.COM LAUNCHES NEW TURNKEY SECTION SHOWCASING 7 COMPLETE SMT ASSEMBLY SYSTEMS

Industry News | 2010-01-11 15:10:30.0

Manncorp has introduced seven new electronic assembly turnkey lines with throughput rates ranging from prototyping to 10,500 cph. The lines are described at www.manncorp.com/turnkey and according to CEO Henry Mann, are targeted to “OEMs and others who are considering turning away from outsourcing by bringing PCB assembly in-house for the first time. The systems are also beamed to existing assemblers who wish to upgrade to latest-generation equipment.”

Manncorp

Essemtec Provides Easy Programming for Flexible Small Batch/ Prototype/ NPI Assembly

Industry News | 2014-05-01 07:47:51.0

Not only the placement speed, but the flexibility of component parts and PCB formats, as well as the ease of programming and the reliability of the assembly from lot size 1 are the decisive criteria for small batch/ prototype production.

ESSEMTEC AG

New PCI Express Root Complex Lite Solution Uses the LatticeECP3 FPGA Family

Industry News | 2010-11-02 11:05:41.0

Lattice Semiconductor Corporation today announced the immediate availability of the PCI Express Root Complex (RC) Lite solution based on the LatticeECP3™ and LatticeECP2M™ FPGA families for use in simple bridging application to any legacy host bus.

Lattice Semiconductor

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