Industry News: 10.8 (Page 1 of 1)

North American PCB Industry Growth Continues - IPC Releases PCB Industry Results for July 2018

Industry News | 2018-09-03 19:54:47.0

IPC announced today the July 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Year-over-year growth continued for industry sales and orders. The book-to-bill ratio for July held steady at 1.05.

Association Connecting Electronics Industries (IPC)

North American PCB Order Growth Pushes Book-to-Bill Ratio Higher

Industry News | 2017-06-01 22:06:44.0

IPC announced today the April 2017 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Although sales continued below last year’s levels, orders were up and the PCB book-to-bill ratio continued to climb, reaching 1.09.

Association Connecting Electronics Industries (IPC)

IPC Releases PCB Industryh Results For September 2011

Industry News | 2011-10-28 00:22:49.0

IPC announced the September findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

Indium Corporation’s New Indium10.8HF Solder Paste Technology Exhibits Best-in-Class Non-Wet Open Performance

Industry News | 2016-03-22 16:57:05.0

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.

Indium Corporation

Indium Corporation’s New Indium10.8HF Solder Paste Technology Exhibits Best-in-Class Non-Wet Open Performance

Industry News | 2016-03-23 20:19:20.0

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.

Indium Corporation

Methode Electronics, Inc. Applies to List Shares on the New York Stock Exchange 10/8/2007 12:32 PM

Industry News | 2007-10-09 00:03:57.0

Methode Electronics, Inc. (Nasdaq: METH), today announced that it has filed an application to list its common stock on the New York Stock Exchange. Upon approval of its application, the Company anticipates that its shares of common stock will begin trading on the NYSE on October 17, 2007, under the symbol "MEI". Until that time, Methode Electronics' common stock will continue to trade on the Nasdaq Global Select Market under the symbol "METH".

Methode Electronics, Inc.

BTU International Reports Second Quarter 2009 Results

Industry News | 2009-07-28 16:38:07.0

NORTH BILLERICA, Mass., Jul 28, 2009 (BUSINESS WIRE) -- BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment and processes to the alternative energy and electronics manufacturing markets, today announced its financial results for the second quarter, which ended on June 28, 2009.

BTU International

Henkel increases sales and earnings

Industry News | 2009-03-02 22:58:58.0

Business results reflect National Starch acquisition and Ecolab sale

Henkel Electronic Materials

Henkel reports substantial increase in sales and earnings in the second quarter

Industry News | 2010-08-09 15:22:28.0

“Following a very good start to fiscal 2010, we have now seen our operations continue their successful development in the second quarter, with our Adhesive Technologies and Cosmetics/Toiletries business sectors making a particularly strong contribution..."

Henkel Electronic Materials

Tyco Electronics Reports Third Quarter Results

Industry News | 2009-07-30 21:15:21.0

SCHAFFHAUSEN, Switzerland, July 29 /PRNewswire-FirstCall/ -- Tyco Electronics Ltd. (NYSE: TEL) today reported results for the fiscal third quarter ended June 26, 2009.

TE Connectivity

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