Industry News | 2018-10-18 11:19:07.0
How To Design Cost-Effective PCBs
Industry News | 2020-08-19 04:01:24.0
Accu-Assembly Inc. is pleased to introduce the AccuID. The new bench top system has been designed to easily produce a unique Reel ID barcode label for each SMT component reel than having an operator scan one label at a time using a hand scanner. The operator does not have to decide which barcode labels to scan resulting in fewer scan errors. The AccuID has a simple user interface: the operator places the reel in the system and the scan begins automatically.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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