Industry News: 120

IPC APEX EXPO 2012 Show Floor and Exhibitors Basking in the Sunshine of San Diego

Industry News | 2011-10-08 17:53:09.0

Heralding two exhibit floors at its new home in the San Diego Convention Center, one of which is already completely sold out, IPC APEX EXPO® and its 2012 exhibitors are relishing in the sunshine of the show’s move to San Diego, February 28-March 1, 2012.

Association Connecting Electronics Industries (IPC)

New SIPLACE SX4 sets records in performance per square meter

Industry News | 2010-08-17 13:40:20.0

The SIPLACE Team has unveiled its latest placement machine, the SIPLACE SX4. As a high-speed addition to the SIPLACE SX platform, the four-gantry machine sets new standards in terms of placement performance per square meter of floor space – an important metric in the investment decision-making process. With its placement speed of up to 120,000 cph on a footprint of only 1.90 x 2.65 meters, the new machine even surpasses the previous record-holder SIPLACE X4i in terms of performance per square meter.

ASM Assembly Systems GmbH & Co. KG

Siemens New Product Preview APEX 2008 � Booth #2359

Industry News | 2008-03-04 12:14:09.0

SIPLACE X4i � Siemens placement machine with the world�s fastest throughput

Siemens Process Industries and Drives

Balver Zinn/Cobar Leads the Way in Micro-Alloy Technologies at SMT Nuremberg 2014

Industry News | 2014-04-07 17:54:09.0

The Balver Zinn Group announces it will attend SMT/Hybrid/Packaging 2014, scheduled to take place May 6-8 in Nuremberg, Germany.

Balver Zinn

Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

Industry News | 2007-11-08 21:34:39.0

Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.

i3 Electronics

Kester's Peter Biocca to Present at SMTA Atlanta 2009

Industry News | 2009-04-13 16:28:45.0

ITASCA, IL � April 2009 � Kester's Peter Biocca, along with Carlos Rivas of SMT Dynamics, will present a paper titled, �Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level,� at the upcoming 13th Annual Atlanta Expo scheduled to take place at 1 p.m. on Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Kester

SMT/Hybrid/Packaging 2010

Industry News | 2010-05-04 08:04:45.0

After the highly successful introduction of its SIPLACE SX1 and SX2 placement machines featuring swappable gantries (“Capacity-on-Demand”), Siemens Electronics Assembly Systems will unveil the new SIPLACE SX4 at the SMT/Hybrid/Packaging trade show in Nuremberg, Germany (June 6-8, 2010; Hall 7, Booth 204).

Siemens Process Industries and Drives

Computrol’s Capabilities Provide Customers with Cost-Efficient Contract Manufacturing

Industry News | 2010-08-27 23:40:34.0

Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronics manufacturing services to OEMS, announces that it provides a host of advanced capabilities to deliver precise execution on every product it builds.

Computrol, Inc.

Saelig Announces the 2/4-channel 100-350Hz Siglent SDS2000X Plus Series Oscilloscopes

Industry News | 2020-01-16 11:15:56.0

New series builds on previous 2000X models to bring 200Mpt memory, 10” touch-screen, external mouse/keyboard control, built-in web server, and 50MHz waveform generator.

Saelig Co. Inc.

  1 2 Next

120,000 searches for Companies, Equipment, Machines, Suppliers & Information