Industry News | 2015-12-02 17:52:02.0
Nordson EFD introduces Unity™ HiTemp™ syringe barrels. These disposable 30cc barrels reduce the downtime and maintenance costs often associated with aluminum barrels commonly used in the pneumatic dispensing of hot melt adhesives.
Industry News | 2005-12-19 16:34:56.0
SCC-700 Quickly cools high temp applications with minimal floor space.
Industry News | 2012-09-05 08:13:47.0
Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition
Industry News | 2010-06-23 12:33:29.0
FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.
Industry News | 2010-10-04 16:32:22.0
FINETECH will showcase the FINEPLACER® Lambda in booth 706 at the upcoming IMAPS 2010 Exhibition, scheduled for November 2-4, 2010 at the Raleigh Convention Center - Research Triangle in Raleigh, NC.
Industry News | 2011-01-05 15:36:14.0
FINETECH will showcase the FINEPLACER® Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.
Industry News | 2011-02-14 16:47:35.0
FINETECH will showcase the FINEPLACER® Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.
Industry News | 2011-09-12 13:16:36.0
FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition
Industry News | 2007-11-27 12:13:09.0
FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.
Industry News | 2009-01-16 17:14:22.0
FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009