Industry News | 2020-04-02 14:42:58.0
Due to the ongoing COVID-19 pandemic, Blackfox is offering online IPC training and certification beginning in mid-April.
Industry News | 2013-08-20 23:02:16.0
Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.
Industry News | 2012-09-26 15:57:01.0
l IPC Electronic System Technologies Conference (ESTC) will take place May 20–23, 2013, with an accompanying exhibition on May 21–22 at the New Tropicana Hotel in Las Vegas.
Industry News | 2013-03-27 18:12:53.0
IPC Electronic System Technologies Conference and Exhibition (IPC ESTC), May 20–23, in Las Vegas.
Industry News | 2013-03-07 19:40:38.0
The need to look at the big picture or the whole electronic system rather than focusing on its individual parts is the impetus of the IPC Electronic System Technologies Conference and Exhibition (ESTC).
Industry News | 2008-10-20 20:23:29.0
COLORADO SPRINGS, CO � October 20, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that customers may now order online via its new Web site.
Industry News | 2016-03-07 20:23:47.0
Cogiscan is pleased to announce that it will highlight the latest version of its Factory Intelligence OEE software at the IPC Apex Expo.
Industry News | 2008-03-20 20:23:23.0
NASHVILLE � March 2008 � Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, its CTO, will co-host the Cleaning & Alternatives Subcommittee with William Kenyon, Ph.D., Global Centre for Process Change Inc., on Monday, March 31, 2008 from 9 a.m. until noon.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2011-04-20 23:13:25.0
Pickering Interfaces is expanding its range of PXI RF switches with the introduction of the 40-755 multiplexer modules.
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