Industry News | 2010-07-10 08:39:05.0
BEST Partners with MRC to bring customers SMT Metal Stencils
Industry News | 2010-07-10 08:36:16.0
Partners with MRC to bring high quality stencils quickly and with an accent on service
Industry News | 2019-05-12 15:58:00.0
Fast Shipment of Custom SRT Nozzles
Industry News | 2017-06-22 12:59:47.0
This 2000L 2LE model is capable of imaging a maximum size 24” x 24” PC board or film size. With any large format film, positional accuracy can be a challenge but the Miva’s dynamic scaling feature can increase accuracy to minimize tolerance build-ups during the imaging process. Due to Miva’s optical registration system, innerlayer drill break-out will be reduced considerably on densely routed signal layers which will significantly improve yields. For sub-20-mil pitch parts or micro BGAs, a 2−3 mil solder dam will be possible to eliminate bridging during the assembly process.
Industry News | 2014-05-12 14:51:12.0
DDM Novastar launches of a brand new entry-level pick and place machine. The L-SF40 is a complete, affordable turnkey automatic pick and place system that can be put in production right out of the box. The system is managed by a full desktop Windows® computer with flat screen monitor.
Industry News | 2013-04-05 11:14:05.0
A-Laser, will highlight its new laser marking capability in Booth #521 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA.
Industry News | 2011-08-01 16:08:33.0
Practical Components has added additional test boards and kits for testing for process cleanliness and conformal coating.
Industry News | 2014-05-12 11:02:56.0
DDM Novastar introduces new entry-level pick and place machine.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2017-03-07 09:21:51.0
PNC Inc. recently purchased an SE500-II solder paste inspection machine from CyberOptics. In addition to other recent purchases, this machine completes another fully-equipped, top-of-the-line assembly line for the company. The SE500-II can scan 30% faster than its predecessors thanks to its unique all-in-one scan sequence. This allows it to inspect PC boards at a rate faster than 80 cm2/second. Adding to its efficiency is the streamlined and intuitive V5 series software. The multi-touch interface allows the operator to access any number of the various essential applications in seconds.
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