Industry News | 2023-11-20 15:39:15.0
Heraeus Electronics is proud to announce its receipt of the prestigious 2023 GLOBAL Technology Award in the category of Solder Paste. The award highlights the contribution made by Heraeus Electronics' Microbond® SMT660 Innolot® 2.0 solder paste. The award was announced during an award ceremony that took place at productronica in Munich on Nov. 14, 2023.
Industry News | 2023-09-11 17:31:10.0
Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals. The event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. Heraeus Electronics will present its groundbreaking Microbond® SMT660 Innolot and Microbond® SMT660 Innolot® 2.0 Solder Pastes, and showcase its exceptional sinter paste innovations, including the PE338 Silver and PE401 Copper Pressure Sinter Paste in Booth #1230.
Industry News | 2024-03-18 12:13:13.0
Heraeus Electronics is excited to announce its participation in the upcoming 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. Heraeus Electronics will be exhibiting in Booth 3912, showcasing its cutting-edge products, including the award-winning Microbond® SMT660 Innolot® 2.0 solder paste.
Industry News | 2023-10-30 19:10:41.0
Heraeus Electronics is pleased to announce that it has been honored with a 2023 Mexico Technology Award in the category of Solder Paste – No-clean. The award recognizes Heraeus Electronics' contribution to the automotive industry with its Microbond® SMT660 Innolot® 2.0 Solder Paste. The award was announced during a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
Industry News | 2023-02-27 18:30:26.0
Heraeus Electronics is pleased to announce the release of its new Microbond® SMT660 Innolot® 2.0 no-clean printing T4 solder paste. The new high reliability, high performance solder paste provides a competitive TCO offering. Based on Heraeus Electronics' proven experience, Innolot 2.0 allows a wide process window, enabling soldering in air with a low defect rate. Additionally, it is designed to offer an optimized formulation for lower costs.
Industry News | 2016-03-09 11:23:40.0
CAMI Research Inc. (Acton, MA) announces a new board for its CableEye cable and harness testing systems. Populated with solder pads to accept a suite of TE-Connectivity™ Micro-MaTch connectors, the board addresses markets plagued by vibration and fretting corrosion, and requiring “miniaturized connectivity”. Rated to 500Vdc/350Vac, the CB49 may be used on all CableEye models.
Industry News | 2023-10-09 09:27:44.0
Printed circuit board assemblies (PCBAs) and integrated circuits (ICs) are the focus of NEPCON Asia, which will be held October 11-13, 2023, in Shenzhen, China's southern hub of electronics innovation. Germany's Viscom AG will be represented by a select Asian team and four of its many advanced inspection systems: S3088 ultra chrome for 3D SPI, S3088 ultra chrome as a 3D AOI configuration, iX7059 PCB Inspection XL from Viscom's large 3D AXI portfolio, and the X8011-III 3D MXI system.
Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
| 1 |
