Industry News: 20um (Page 1 of 1)

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

MES Jump Starts 2014 with NEW Laser Cutting Stencil System

Industry News | 2014-01-10 19:59:46.0

MES Jump Starts 2014 with NEW Laser Cutting Stencil System.

Metal Etch Services, Inc.

San Francisco Circuits Now Offers Micro-Circuits

Industry News | 2012-09-10 19:45:44.0

San Francisco Circuits is now offering Micro-Circuits.

San Francisco Circuits

San Francisco Circuits to Exhibit at PCB West 2012

Industry News | 2012-09-10 20:15:43.0

San Francisco Circuits will be exhibiting at PCB West 2012.

San Francisco Circuits

Metal Etch Services introduces it's newest laser cutting system

Industry News | 2017-01-05 18:58:20.0

Metal Etch Services continues its commitment to provide industry leading SMT Stencils through procuring the most technologically advanced laser system available, LPKF’s G 6080. This new system ensures Metal Etch Services the ability to offer stencils with the cleanest side walls, highest positional accuracy, and fastest cycle times. All these attributes maintain symmetry with our existing laser systems and will surely benefit all those who choose us as their SMT stencil provider.

Metal Etch Services, Inc.

Engineered Material Systems Introduces DF-3020 Antimony Free Dry Film Negative Photoresist

Industry News | 2013-10-29 13:26:58.0

Engineered Material Systems, Inc., is pleased to introduce the DF-3020 Dry Film Negative Photoresist for use in micro-electro-mechanical systems (MEMS).

Engineered Materials Systems, Inc.

High Quality SMT Stencils + Free Technical Assistance

Industry News | 2015-12-10 17:59:21.0

Metal Etch Services has more than 25 years experience manufacturing High Quality SMT Stencils, based on this experience we offer free technical assistance to all our customers.

Metal Etch Services, Inc.

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Practical Components to Exhibit Advanced Technologies at IPC APEX 2020

Industry News | 2020-01-07 11:42:27.0

Practical Components announces that it will showcase its advanced technologies at the IPC APEX exhibition in booth 1600 scheduled to take place February 4-6, 2020 at the San Diego Convention Center in San Diego California.

Practical Components, Inc.

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