Industry News | 2012-05-09 13:58:34.0
A-Tek Systems Group introduces the new Kolb Cleaning Technology C-Class Cleaner Series PS300 to include 4 platforms to chose from: -VL, -VS, -HD, and -CA featuring PowerSpray® technology. The Kolb PS300 C-Class Cleaners are fully automatic, compact and cost competitive without sacrificing cleaning efficiencies and reliability.
Industry News | 2010-03-03 14:29:02.0
OK International (www.okinternational.com) has launched a new soldering system for PV tabbing and bussing applications proven to reduce micro cracking. The PS900 with specially designed hoof tip geometry optimizes the power delivered to the solder joint while it’s temperature-sensitive heater ensures low temperature soldering thus minimizing thermally induced stresses on cell surfaces.
Industry News | 2015-12-02 17:31:50.0
Akrometrix LLC today announced the company’s entry into the Fan Out Wafer Level Processing (FOWLP) market with an innovative, single shot full field of view warpage metrology system for panels up to 600 x 600 mm.
Industry News | 2016-04-29 12:00:45.0
Akrometrix today announced that the company has shipped its 300th shadow moiré metrology system to a leading back-end company in South Korea.
Industry News | 2012-07-29 03:36:45.0
Glichn has expanded its reflow oven series dedicated to bench top solder oven. Included are updates of existing software and different PCB size that combines high performance with easy operation and economical benefits.
Industry News | 2016-03-30 08:12:07.0
Akrometrix today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms.
Industry News | 2003-03-31 11:13:17.0
Finally affordable thermal profiling for CEMs and OEMs
Industry News | 2008-07-19 12:18:17.0
An automated turnkey line now offered by Manncorp includes a 4-head pick and place that provides assets of speed, flexibility and fast changeover. The �Hi Output Line� also includes an inline fully automatic stencil printer, an 8-zone reflow oven and pass-through conveyor, priced below $180,000 complete. According to CEO Henry Mann, �The 10,500 cph placement speed allows mid-volume assemblers to step-up throughput while benefitting from the increased savings and service advantages of purchasing the entire line from a single-source provider.�
Industry News | 2013-10-05 11:01:58.0
Bob Willis launches new webinar topics for the industry. When we start to talk about high temperature electronics it’s not the solder it’s all of the parts that make up an electronics product. Substrates, components, connectors, cables, solder and assembly process need to be examined.
Industry News | 2017-08-08 09:40:33.0
(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.
