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DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

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