Industry News: accept level (Page 1 of 32)

FREE IPC-A-610 and J-STD-001

Industry News | 2017-11-25 20:33:55.0

A-610 and J-STD-001 has recently been updated. This webinar will highlight the changes in the standards

BEST Inc.

Teradyne Awarded Two Service Excellence Awards at APEX

Industry News | 2003-04-07 10:25:38.0

Customers Commend Teradyne's Assembly Test and Connection Systems Divisions

SMTnet

Sparton Corporation�s Design Engineering Team Becomes A Member of the Motorola Design Alliance Program

Industry News | 2003-04-08 14:01:01.0

Sparton's design engineering team is one of 265 worldwide members in the Motorola Design Alliance program.

SMTnet

European Ambitions for PCB Maker

Industry News | 2003-02-27 08:22:44.0

Circatex is to open its first satellite office in mainland Europe in France.

SMTnet

DuPont Electronic Technologies To Appoint Insulectro as National Distributor for Circuit Materials

Industry News | 2003-06-16 08:33:59.0

This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.

SMTnet

DDi Corp. Reports First Quarter Results

Industry News | 2003-05-16 08:49:08.0

PCB Sales Improved

SMTnet

DDI Corp. Provides Update on Negotiations with it's Senior Lenders and Convertible Noteholders

Industry News | 2003-04-04 08:46:37.0

Company Announces Further Reductions to Goodwill and Reclassifications of Indebtedness Recorded in Fiscal 2002

SMTnet

IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference.

Industry News | 2018-10-11 19:15:17.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.

Association Connecting Electronics Industries (IPC)

Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open

Industry News | 2022-12-26 11:44:31.0

The SMTA has announced the accepted speakers for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 14-16, 2023 at the Marriott Fremont Silicon Valley in Fremont, California.

Surface Mount Technology Association (SMTA)

IPC Committee Focuses ON the Box

Industry News | 2011-09-12 15:42:18.0

For the past year, engineers from companies like Honeywell Aerospace and Rockwell Collins have been meeting to lay the groundwork for IPC-A-630, Requirements and Acceptance for Enclosures, better known as “the box build standard.” These volunteers have come largely from the OEMs that specify the cabinetry they will use.

Association Connecting Electronics Industries (IPC)

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