ag/pd termination reflow - SMT Electronics Manufacturing

Industry News: ag/pd termination reflow (Page 1 of 7)

Connector Range has Board-to-cable Options Covered

Industry News | 2003-03-13 08:19:18.0

The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.

SMTnet

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:14:11.0

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Surface-mount technology about (SMT:printing+chip mounter+reflow oven)

Industry News | 2018-10-18 09:17:59.0

Surface-mount technology about (SMT:printing+chip mounter+reflow oven)

Flason Electronic Co.,limited

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)