Industry News: ausn solder (Page 1 of 2)

Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016

Industry News | 2016-01-05 14:46:38.0

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.

Indium Corporation

Indium Corporation Features Gold Alloy Solder Preforms at SPIE Photonics West

Industry News | 2018-12-16 09:10:36.0

Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Photonics West event, February 2-7, in San Francisco, Calif.

Indium Corporation

Micralyne Scientist Wins Second Award for AuSn Solder Research

Industry News | 2004-10-05 14:52:25.0

Dr. Siamak Akhlaghi has received a Silver Medal Award from the American Electroplaters and Surface Finishers Society

Micralyne Inc.

High Accuracy Die Bonder on display at Semicon West 2009

Industry News | 2009-06-23 19:41:14.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.

Finetech

High Accuracy Die Bonder on Display at IMAPS 2009

Industry News | 2009-10-16 19:21:16.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 515 at the upcoming IMAPS 2009 exhibition, scheduled for November 3-5, 2009, at the San Jose Convention Center in San Jose, Calif.

Finetech

High Accuracy Die Bonder on Display at SPIE Photonics West 2010

Industry News | 2010-01-07 20:09:26.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.

Finetech

NEPCON China 2008 - FINEPLACER�Lambda

Industry News | 2008-04-07 21:09:26.0

FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.

Finetech

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Industry News | 2013-01-04 08:55:03.0

Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder

Finetech

FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Industry News | 2010-06-23 12:33:29.0

FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

Finetech

Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West

Industry News | 2024-01-29 11:36:51.0

Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world's premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.

Indium Corporation

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