Industry News | 2003-04-30 08:51:08.0
Electrolube played the role of environmental champion in Australia recently.
Industry News | 2010-08-10 14:56:47.0
Aqueous Technologies Corp., North America’s largest provider of batch defluxing systems, announces that Mike Konrad will speak at Surface Mount 2010 in Sydney, Australia on Thursday, September 9 at 1 p.m. at the Australian Technology Park in Eveleigh, Sydney.
Industry News | 2006-03-13 21:39:52.0
Toronto, Ontario Canada � March 10, 2006 9:00 AM EST
Industry News | 2010-08-09 12:37:17.0
KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Suba Engineering PTY LTD will highlight its MVP profile fixture in booth D8 at the upcoming Electronex 2010, scheduled to take place September 8-9, 2010 at the Australian Technology Park in Sydney, Australia. The MVP profile fixture is ideal for viewing changes in reflow ovens and determining how those changes affect the profile of production boards.
Industry News | 2010-09-07 12:12:54.0
Altium is returning to its home roots: the company is previewing the next release of its electronics design solution Altium Designer at ElectroneX, being held in Sydney tommorow.
Industry News | 2012-08-01 16:44:06.0
Nihon Superior Co., Ltd. pleased to announce the establishment within the Faculty of Engineering, Architecture and Information Technology of the University of Queensland, Australia of the Nihon Superior Centre for Manufacture of Electronic Materials (NS CMEM).
Industry News | 2002-04-08 08:32:45.0
Regional Powerhouses Team Up to Deliver Tecnomatix eMPower Solutions to Rapidly Growing Asian Electronics Manufacturing Market
Industry News | 2008-03-08 04:04:22.0
OSAKA, JAPAN � March 7, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is collaborating with the University of Queensland (Australia) in the investigation of the growth and properties of the intermetallic compounds that form between solder alloys and the soldered substrate.
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