Industry News: backside (Page 1 of 3)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

SEZ, IMEC to Explore Next-generation Wafer Cleaning Technologies

Industry News | 2002-04-11 08:38:03.0

A Joint-development Initiative for Environmentally Friendly, "Economically Viable" Wafer Cleaning Technology

IMEC

Henkel's New Wafer Backside Coating� Portfolio Revolutionizes Die Attach Processes

Industry News | 2008-08-01 00:29:58.0

With the well-respected die attach brands of Hysol� and Ablestik�, Henkel has long been recognized for consistently pushing the bar higher when it comes to advanced semiconductor materials development. This pioneering philosophy has led to the development of yet another groundbreaking materials advance and the launch of Henkel's Ablestik 8000� Wafer Backside Coating� (WBC) technology.

Henkel Electronic Materials

Amkor ULTRA CSP� Test Die

Industry News | 2002-09-17 15:09:18.0

Practical Dummy Components

Practical Components, Inc.

Schlumberger Launches IC Modification Tool to Cut Costs and Cycle Times

Industry News | 2002-04-03 08:20:04.0

New Focused Ion Beam (FIB) IC Modification Tool

Schlumberger RMS

Metallization line �in a box� helps solar cell start-ups and enables �pay as you grow� flexibility

Industry News | 2008-03-15 16:01:18.0

DEK has announced a complete metallization line for solar-cell production rated at 1200 wafers per hour, saving manufacturers the time and expense of commissioning and integrating equipment from multiple suppliers. The first showing of this new line will be at BTU�s Solar Lab Grand Opening, in Shanghai, 18-19 March 2008.

ASM Assembly Systems (DEK)

DEK Raises the Bar on DirEKt Coat™ Technology

Industry News | 2009-08-10 20:22:02.0

2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.

ASM Assembly Systems (DEK)

See Christopher Associates’ Range of New Technologies at Solar Power International 2010

Industry News | 2010-10-04 16:03:17.0

Christopher Associates is pleased to announce that it will display an extensive range of new technologies in Booth #333 at the upcoming Solar Power International, scheduled to take place October 12-14, 2010 at the Los Angeles Convention Center in Los Angeles, CA.

Christopher Associates Inc.

Christopher Associates to Exhibit at the 1st SEMA Technical Conference & Exhibition

Industry News | 2011-04-27 19:43:54.0

Christopher Associates Inc. will showcase its latest solar solutions in Booth #101 at the 1st SEMA Technical Conference and Exhibition, scheduled to take place May 24-26, 2011 at the Wyndham Hotel in San Jose, CA.

Christopher Associates Inc.

Christopher Associates to Exhibit A Range of New Solar Technologies at Intersolar North America 2011

Industry News | 2011-06-13 17:27:43.0

Christopher Associates Inc. will display an extensive range of new technologies in the North Hall, Stand 5706 at the upcoming Intersolar North America 2011, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.

Christopher Associates Inc.

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