Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2019-05-16 01:24:13.0
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
Industry News | 2011-11-08 14:14:14.0
Michelle Ogihara, Senior Sales Manager with Seika Machinery, Inc. will attend the Seika Sangyo GmbH Booth 317 in Hall A2 at the upcoming Productronica International Trade Fair
Industry News | 2011-02-14 14:41:46.0
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut new products and features from McDry in Booth #459 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2017-08-17 06:55:03.0
what is SMT and where to by SMT spare parts
Industry News | 2022-05-05 17:43:39.0
MacDermid Alpha Electronics Solutions will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.
Industry News | 2018-08-26 20:27:12.0
DIVSYS International, LLC (DIVSYS) marks another milestone by joining forces with ICAPE Group, based in France.
Industry News | 2012-05-31 14:49:02.0
Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
